Solid-state imaging element, imaging device, and method for controlling solid-state imaging element

ABSTRACT

Color mixing between pixels is prevented in a solid-state imaging element in which a pair of pixels for detecting the phase difference of a pair of light rays are arranged. A pair of photoelectric conversion elements receive a pair of light rays made by pupil-splitting. A floating diffusion layer generates a pair of pixel signals from electric charge transferred from each of the pair of photoelectric conversion elements. A pair of transfer transistors transfer the electric charge from the pair of photoelectric conversion elements to the floating diffusion layer. In a case of detecting the phase difference of the pair of light rays from the pair of pixel signals, the control unit takes control so that back gate voltages that include the back gate potentials of both of the pair of transfer transistors with respect to the potential barrier between the pair of photoelectric conversion elements have values different from values in a case of synthesizing the pair of pixel signals.

TECHNICAL FIELD

The present technology relates to a solid-state imaging element, animaging device, and a method for controlling a solid-state imagingelement. To be more specific, the present invention relates to asolid-state imaging element and an imaging device for detecting a phasedifference between a pair of light rays, and a method for controllingthe solid-state imaging element.

BACKGROUND ART

Conventionally, a phase difference AF (Auto Focus) method for detectingthe phase difference of a pair of pupil-split light rays has been usedin imaging devices for the purpose of determining the focusing positionof the lens. For example, a solid-state imaging element in which a pairof pixels that receive a pair of pupil-split light rays are arranged onan image surface has been proposed (see, for example, PTL 1).

CITATION LIST Patent Literature

[PTL 1]

Japanese Patent Laid-open No. 2013-41890

SUMMARY Technical Problems

In the above-mentioned conventional technique, a phase difference isdetected from each pixel signal of a pair of pixels, and thereby thefocusing position of the lens can be obtained from the phase difference.However, when the amount of light is large, there is a problem thatelectric charge overflows in one of the pair of pixels and moves to theother, resulting in color mixing. Due to this color mixing, the accuracyof detecting the phase difference is lowered.

The present technology has been created in view of such a situation, andan object is to prevent color mixing between pixels in a solid-stateimaging element in which a pair of pixels for detecting a phasedifference of a pair of light rays are arranged.

Solution to Problems

The present technology is made to solve the above-mentioned problems,and the first aspect thereof is a solid-state imaging element including,a pair of photoelectric conversion elements that receive a pair of lightrays made by pupil-splitting, a floating diffusion layer that generatesa pair of pixel signals from electric charge transferred from each ofthe pair of photoelectric conversion elements, a pair of transfertransistors that transfer the electric charge from the pair ofphotoelectric conversion elements to the floating diffusion layer, and acontrol unit that takes control such that back gate voltages thatinclude the back gate potentials of both of the pair of transfertransistors with respect to the potential barrier between the pair ofphotoelectric conversion elements have values different from values in acase of synthesizing the pair of pixel signals, in a case of detectingthe phase difference of the pair of light rays from the pair of pixelsignals, and a method for controlling the solid-state imaging element.This brings about an effect of control so that the back gate voltages ofboth of the pair of transfer transistors at the time of focusing are setto different values from those at the time of imaging.

Further, in the first aspect, a reset transistor for initializing theamount of the electric charge in the floating diffusion layer may befurther provided, and the control unit may control the back gatevoltages by controlling the drain potential of the reset transistor.This brings about an effect of control so that the back gate voltages ofboth of the pair of transfer transistors at the time of focusing are setto different values from those at the time of imaging by controlling thedrain potential.

Further, in the first aspect, a reset drain drive wiring for connectingthe drain of the reset transistor and the control unit may be providedto allow the control unit to control the drain potential via the resetdrain drive wiring. This brings about the effect of controlling thedrain potential by the control unit via the reset drain drive wiring.

Further, in the first aspect, the control unit may control the back gatevoltages by controlling the gate potentials of both of the pair oftransfer transistors. This brings about an effect of control so that theback gate voltages of both of the pair of transfer transistors at thetime of focusing are set to values different from those at the time ofimaging by controlling the gate potential.

Further, in the first aspect, the electric charge includes an electron,and the control unit may take control so as to set the back gatevoltages to higher voltages in the case of detecting the phasedifference than in the case of synthesizing the pair of pixel signals.This brings about an effect of control so that the back gate voltages ofboth of the pair of transfer transistors at the time of focusing are setto different values from those at the time of imaging when electrons aretransferred.

Further, in the first aspect, the control unit may control the back gatevoltages after the start of exposure of the pair of photoelectricconversion elements in the case of synthesizing the pair of pixelsignals. This bring about the effect of controlling the back gatevoltages after the start of exposure.

Further, in the first aspect, an on-chip lens that collects a light rayand a color filter that allows a light ray having a wavelength within apredetermined wavelength range and coming from the on-chip lens to passthrough the color filter are further provided, and the pair ofphotoelectric conversion elements may receive the light ray that haspassed through the color filter. This brings about an effect ofcapturing a color image.

Further, the second aspect of this technology is an imaging deviceincluding a pair of photoelectric conversion elements that receive apair of light rays made by pupil-splitting, a floating diffusion layerthat generates a pair of pixel signals from the electric chargetransferred from each of the pair of photoelectric conversion elements,a pair of transfer transistors that transfer the electric charge fromthe pair of photoelectric conversion elements to the floating diffusionlayer, a control unit that takes control such that back gate voltagesthat include the back gate potentials of both of the pair of transfertransistors with respect to the potential barrier between the pair ofphotoelectric conversion elements have values different from values inthe case of synthesizing the pair of pixel signal, in the case ofdetecting the phase difference of the pair of light rays from the pairof pixel signals, and a processing unit that performs a process ofsynthesizing the pair of pixel signals. This brings about an effect ofcontrol so that the back gate voltages of both of the pair of transfertransistors at the time of focusing are set to different values fromthose at the time of imaging, and the image data is captured.

Advantageous Effect of Invention

According to the present technology, in a solid-state imaging element inwhich a pair of pixels for detecting a phase difference of a pair oflight rays are arranged, an excellent effect can be obtained so thatcolor mixing between the pixels can be prevented. Incidentally, theeffects are not necessarily limited to those described herein, and maybe any of the effects described in the present disclosure.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a block diagram illustrating a configuration example of animaging device according to a first embodiment of the presenttechnology.

FIG. 2 is a block diagram illustrating a configuration example of asolid-state imaging element according to the first embodiment of thepresent technology.

FIG. 3 is an example of the plan view of a pixel array unit according tothe first embodiment of the present technology.

FIG. 4 is an example of the plan view of an FD (Floating Diffusion)sharing block according to the first embodiment of the presenttechnology.

FIG. 5 is a circuit diagram illustrating a configuration example of theFD sharing block according to the first embodiment of the presenttechnology.

FIG. 6 is an example of a cross-sectional view of the pixel array unitaccording to the first embodiment of the present technology.

FIG. 7 is an example of a cross-sectional view of a pixel according tothe first embodiment of the present technology.

FIG. 8 is an example of a cross-sectional view of the FD sharing blockaccording to the first embodiment of the present technology.

FIG. 9 is a plan view illustrating a wiring example of a transfer gatedrive wiring according to the first embodiment of the presenttechnology.

FIG. 10 is a plan view illustrating a wiring example of a reset gatedrive wiring, a selection gate drive wiring, and a reset drain drivewiring according to the first embodiment of the present technology.

FIG. 11 is a plan view illustrating a wiring example of a verticalsignal line, a power supply line, and a ground line according to thefirst embodiment of the present technology.

FIG. 12 is a timing chart illustrating an example of the operation ofthe solid-state imaging element during the focusing period in the firstembodiment of the present technology.

FIG. 13 is a timing chart illustrating an example of the operation ofthe solid-state imaging element during the imaging period in the firstembodiment of the present technology.

FIG. 14 is a graph illustrating an example of the relationship between areset drain potential and a transfer back gate potential in the firstembodiment of the present technology.

FIG. 15 is an example of a potential diagram at the time of focusing inthe first embodiment of the present technology.

FIG. 16 is an example of a potential diagram at the time of imaging inthe first embodiment of the present technology.

FIG. 17 is a graph illustrating an example of the total signal amountaccording to the exposure time in the first embodiment of the presenttechnology.

FIG. 18 is a flowchart illustrating an example of the operation of thesolid-state imaging element according to the first embodiment of thepresent technology.

FIG. 19 is a circuit diagram illustrating a configuration example of anFD sharing block according to a second embodiment of the presenttechnology.

FIG. 20 is a timing chart illustrating an example of the operation of asolid-state imaging element during the focusing period in the secondembodiment of the present technology.

FIG. 21 is a timing chart illustrating an example of the operation ofthe solid-state imaging element during the imaging period in the secondembodiment of the present technology.

FIG. 22 is a block diagram depicting an example of schematicconfiguration of a vehicle control system.

FIG. 23 is a diagram of assistance in explaining an example ofinstallation positions of an outside-vehicle information detectingsection and an imaging section.

DESCRIPTION OF EMBODIMENTS

Hereinafter, modes for carrying out the present technology (hereinafterreferred to as embodiments) will be described. The description will begiven in the following order.

1. First embodiment (example of controlling transfer back gate voltages)

2. Second embodiment (example of controlling the transfer back gatevoltages by controlling the gate potential)

3. Third embodiment (example of application to a mobile body)

1. First Embodiment Configuration Example of Imaging Device

FIG. 1 is a block diagram illustrating a configuration example of animaging device 100 according to the first embodiment of the presenttechnology. The imaging device 100 is a device for capturing image data,and includes an optical unit 110, a solid-state imaging element 200, anda DSP (Digital Signal Processing) circuit 120. Further, the imagingdevice 100 includes a display unit 130, an operation unit 140, a bus150, a frame memory 160, a storage unit 170, and a power supply unit180. As the imaging device 100, for example, in addition to a digitalcamera such as a digital still camera, a smartphone, a personalcomputer, an in-vehicle camera, or the like having an imaging functionis assumed.

The optical unit 110 collects light from the subject and guides thelight to the solid-state imaging element 200. The optical unit 110 isprovided with a plurality of lenses including a focus lens. The positionof the focus lens is controlled by a driving signal from the solid-stateimaging element 200.

The solid-state imaging element 200 generates image data byphotoelectric conversion in synchronization with a verticalsynchronization signal VSYNC. Here, the vertical synchronization signalVSYNC is a periodic signal having a predetermined frequency indicatingthe timing of imaging. The solid-state imaging element 200 supplies thegenerated image data to the DSP circuit 120 via a signal line 209.Further, the solid-state imaging element 200 supplies a driving signalto the optical unit 110 via a signal line 208.

The DSP circuit 120 executes predetermined signal processing on theimage data from the solid-state imaging element 200. The DSP circuit 120outputs the processed image data to the frame memory 160 or the like viathe bus 150.

The display unit 130 displays image data. As the display unit 130, forexample, a liquid crystal panel or an organic EL (Electro Luminescence)panel is assumed. The operation unit 140 generates an operation signalin accordance with the operation of the user.

The bus 150 is a common route for the optical unit 110, the solid-stateimaging element 200, the DSP circuit 120, the display unit 130, theoperation unit 140, the frame memory 160, the storage unit 170, and thepower supply unit 180 to exchange data with each other.

The frame memory 160 holds image data. The storage unit 170 storesvarious kinds of data such as image data. The power supply unit 180supplies power to the solid-state imaging element 200, the DSP circuit120, the display unit 130, and the like.

Configuration Example of Solid-State Imaging Element

FIG. 2 is a block diagram illustrating a configuration example of thesolid-state imaging element 200 according to the first embodiment of thepresent technology. The solid-state imaging element 200 includes a rowscanning circuit 210, a timing control unit 220, and a pixel array unit300. Further, the solid-state imaging element 200 includes column signalprocessing units 230 and 240, a focusing unit 250, and an imageprocessing unit 260. A plurality of pixels is arranged in atwo-dimensional lattice shape in the pixel array unit 300.

The row scanning circuit 210 drives each of the rows in the pixel arrayunit 300 in turn to output an analog pixel signal. Pixels in a certainrow output pixel signals to the column signal processing unit 230, andpixels in another row different from the row output pixel signals to thecolumn signal processing unit 240.

The timing control unit 220 controls the operation timing of the rowscanning circuit 210 and the column signal processing units 230 and 240in synchronization with the vertical synchronization signal VSYNC.

The column signal processing unit 230 executes signal processing such asAD (Analog-to-Digital) conversion processing and CDS (Correlated DoubleSampling) processing on the pixel signals from the rows. The columnsignal processing unit 240 executes signal processing on pixel signalsfrom a row different from that of the column signal processing unit 230.The column signal processing units 230 and 240 supply the processedpixel signal to the focusing unit 250 and the image processing unit 260.By arranging both the column signal processing units 230 and 240,read-out can be performed in two rows at the same time. Incidentally,only one of the column signal processing units 230 and 240 may bearranged.

The focusing unit 250 detects the phase difference between the pair ofpupil-split light rays and obtains the focusing position of the focuslens. The focusing unit 250 generates a driving signal for driving thefocus lens to move to the obtained focusing position, and supplies thedriving signal to the optical unit 110 via the signal line 208. Further,when the focus lens is driven, the focusing unit 250 generates afocusing flag indicating that focusing is completed, and supplies thefocusing flag to the image processing unit 260.

The image processing unit 260 generates image data after the end offocusing and performs predetermined image processing. The imageprocessing unit 260 supplies the processed image data to the DSP circuit120 via the signal line 209.

Configuration Example of Pixel Array Unit

FIG. 3 is an example of the plan view of the pixel array unit 300according to the first embodiment of the present technology. A pluralityof FD sharing blocks 301 is arranged in a two-dimensional lattice shapein the pixel array unit 300. A plurality of pairs of pixels sharing thefloating diffusion layer is arranged in the FD sharing block 301. Forexample, in the FD sharing block 301, four pairs of pixels, which are apair of L (Left) pixel 310 and R (Right) pixel 320, a pair of L pixel330 and R pixel 340, a pair of L pixel 350 and R pixel 360, and a pairof L pixel 370 and R pixel 380, are provided. The L pixel and the Rpixel (such as the L pixel 310 and the R pixel 320) forming the pairreceive the pair of pupil-split light rays. These eight pixels share onefloating diffusion layer.

Hereinafter, the direction parallel to the row is referred to as “Xdirection,” and the direction parallel to the column is referred to as“Y direction.” Further, the direction perpendicular to the X directionand the Y direction is referred to as the “Z direction.”

Configuration Example of FD Sharing Block

FIG. 4 is an example of a plan view of the FD sharing block 301according to the first embodiment of the present technology. A floatingdiffusion layer 384 is disposed at the center of the FD sharing block301. Further, transfer transistors 312, 332, 352, 372, 322, 342, 362,and 382 are arranged on the L pixels 310, 330, 350, and 370 and the Rpixels 320, 340, 360, and 380.

Further, a reset transistor 383, an amplification transistor 385, and aselection transistor 386 are arranged below the FD sharing block 301with the predetermined direction in the Y direction as the upwarddirection. It should be noted that a photoelectric conversion element isfurther arranged in each of the pixels but is omitted in the figure forconvenience of description.

FIG. 5 is a circuit diagram illustrating a configuration example of theFD sharing block 301 according to the first embodiment of the presenttechnology. The FD sharing block 301 includes photoelectric conversionelements 311, 321, 331, 341, 351, 361, 371, and 381, and the transfertransistors 312, 322, 332, 342, 352, 362, 372, and 382. Further, the FDsharing block 301 includes the reset transistor 383, the floatingdiffusion layer 384, the amplification transistor 385, and the selectiontransistor 386.

The anodes of the photoelectric conversion elements 311, 321, 331, 341,351, 361, 371, and 381 are connected to the ground terminal via a groundline 302.

A transfer signal TGL0 from the row scanning circuit 210 is input to thegates of the transfer transistors 312 and 332 via a transfer gate drivewiring 211. The transfer signal TGR0 from the row scanning circuit 210is input to the gates of the transfer transistors 322 and 342 via atransfer gate drive wiring 212. Further, a transfer signal TGL1 from therow scanning circuit 210 is input to the gates of the transfertransistors 352 and 372 via a transfer gate drive wiring 213. Thetransfer signal TGR1 from the row scanning circuit 210 is input to thegates of the transfer transistors 362 and 382 via a transfer gate drivewiring 214.

The drain of the reset transistor 383 is connected to the row scanningcircuit 210 by a reset drain drive wiring 215. A reset drain signal RSTdis input to the drain of the reset transistor 383 via the reset draindrive wiring 215, and a reset gate signal RSTg is input to the gatethereof via a reset gate drive wiring 216.

The drain of the amplification transistor 385 is connected to the powersupply terminal via a power supply line 303. A selection signal SEL fromthe row scanning circuit 210 is input to the gate of the selectiontransistor 386 via a selection gate drive wiring 217. Further, with therow of the FD sharing block 301 as the FD row, the sources of theselection transistors 386 of the even-numbered FD rows are connected tothe column signal processing unit 240 via a vertical signal line 304. Onthe other hand, the sources of the selection transistors 386 of theodd-numbered FD rows are connected to the column signal processing unit230 via a vertical signal line 305.

The photoelectric conversion elements 311 and 321 receive a pair ofpupil-split light rays. Similarly, the photoelectric conversion elements331 and 341, the photoelectric conversion elements 351 and 361, and thephotoelectric conversion elements 371 and 381 also respectively receivea pair of pupil-split light rays.

The transfer transistor 312 transfers an electric charge (electrons orthe like) from the photoelectric conversion element 311 to the floatingdiffusion layer 384 in accordance with the transfer signal TGL0.Similarly, the transfer transistors 322, 332, 342, 352, 362, 372, and382 also transfer charges from the respectively correspondingphotoelectric conversion elements to the floating diffusion layer 384 inaccordance with the corresponding transfer signals.

The floating diffusion layer 384 accumulates electric charges andgenerates a pixel signal having a voltage corresponding to the amount ofthe electric charges. Since the eight pixels supply the floatingdiffusion layer 384, each pixel signal of the eight pixels is generatedone by one in order.

The reset transistor 383 sets the charge amount of the floatingdiffusion layer 384 to an initial value in accordance with the resetgate signal RSTg. Further, the row scanning circuit 210 can control thedrain potential of the reset transistor 383 by the reset drain signalRSTd. The details of the control content will be described later.

The amplification transistor 385 amplifies the pixel signal and suppliesthe amplified signal to the selection transistor 386. The selectiontransistor 386 outputs the amplified pixel signal to the correspondingvertical signal line in accordance with the selection signal SEL.

It should be noted that although the floating diffusion layer 384 isshared by 8 pixels, the number of pixels sharing the floating diffusionlayer 384 is not limited to 8 pixels, and may be 2 pixels or 4 pixels.

FIG. 6 is an example of a cross-sectional view of the pixel array unit300 according to the first embodiment of the technique. A color filter402 is arranged on the upper portion of the pair of L pixel and R pixel(L pixel 310, R pixel 320, etc.) with the direction toward the opticalunit 110 as the upward direction in the Z direction. Further, an on-chiplens 401 is disposed on the upper part of the color filter 402.

The on-chip lens 401 collects light and guides the light to the colorfilter 402. The color filter 402 allows the light ray having awavelength within a predetermined wavelength region to pass the filteramong rays coming from the on-chip lens 401.

As exemplified in the figure, the pair of pixels share the color filter402. Therefore, the image processing unit 260 can generate pixel data ofone pixel in the color image data by synthesizing the respective pixelsignals of those pixels. Since four pairs of pixels are arranged in theFD sharing block 301, four pixel data can be generated from these pixelsignals. Note that the image processing unit 260 is an example of theprocessing unit described in the claims.

FIG. 7 is an example of a cross-sectional view of a pixel (L pixel 310etc.) according to the first embodiment of the present technology. Thefigure illustrates a cross-sectional view when the L pixel 310 issectioned along the line A-B on the plan view exemplified in FIG. 4.

The photoelectric conversion element 311 is disposed in a substrate 411.Further, a P layer 412 is formed on the upper portion of thephotoelectric conversion element 311 with the direction toward theoptical unit 110 as the downward direction in the Z direction. Atransfer gate 413, which is a gate electrode of the transfer transistor312, is disposed on the substrate 411 and adjacent to the P layer 412.Further, on the substrate 411, the floating diffusion layer 384 isformed adjacent to a transfer gate 413.

Further, a wiring layer 430 is arranged above the substrate 411, and inthe wiring layer 430, the transfer gate drive wiring 211, the selectiongate drive wiring 217, and the reset gate drive wiring 216 are arrangedto extend in the X direction (row direction). The transfer gate 413 isconnected to the transfer gate drive wiring 211.

FIG. 8 is an example of a cross-sectional view of the FD sharing block301 according to the first embodiment of the present technology. Thefigure illustrates a cross-sectional view when the FD sharing block 301is sectioned along the line E-F on the plan view exemplified in FIG. 4.The substrate 411 is provided with a reset source 421, a reset drain423, an amplifier drain 424, a source/drain 426, and a selection source428.

The reset source 421 and the reset drain 423 are the source and drain ofthe reset transistor 383, and a reset gate 422, which is a gate of thereset transistor 383, is arranged between the source and drain. Further,the reset gate 422 is connected to the reset gate drive wiring 216. Thereset drain 423 is connected to the reset drain drive wiring 215.

The amplifier drain 424 is the drain of the amplification transistor385, and the source/drain 426 is used as both the source of theamplification transistor 385 and the drain of the selection transistor386. The amplifier drain 424 is connected to the power supply line 303.Further, an amplifier gate 425, which is a gate of the amplificationtransistor 385, is arranged between the amplifier drain 424 and thesource/drain 426. The amplifier gate 425 is connected to the resetsource 421, and the signal line connecting these components is omittedin the figure.

The selection source 428 is the source of the selection transistor 386,and a selection gate 427, which is a gate of the selection transistor386, is arranged between the source/drain 426 and the selection source428. The selection gate 427 is connected to the selection gate drivewiring 217.

FIG. 9 is a plan view illustrating a wiring example of the transfer gatedrive wirings 211 to 214 according to the first embodiment of thepresent technology. As exemplified in the figure, the transfer gatedrive wirings 211 to 214 are arranged to extend in the X direction (rowdirection) for each FD row.

FIG. 10 is a plan view illustrating a wiring example of the reset gatedrive wiring 216, the selection gate drive wiring 217, and the resetdrain drive wiring 215 according to the first embodiment of the presenttechnology. As exemplified in the figure, in addition to the reset gatedrive wiring 216 and the selection gate drive wiring 217, the resetdrain drive wiring 215 is further arranged to extend in the X direction(row direction) for each FD row.

FIG. 11 is a plan view illustrating an example of wiring of the verticalsignal lines 304 and 305, the power supply line 303, and the ground line302 in the first embodiment of the present technology. With the row ofthe FD sharing block 301 as the FD column, the vertical signal lines 304and 305, the power supply line 303, and the ground line 302 are arrangedto extend in the Y direction (column direction) for each FD column.

FIG. 12 is a timing chart illustrating an example of the operation ofthe solid-state imaging element 200 in the focusing period in the firstembodiment of the present technology. At the exposure start timing T10,the row scanning circuit 210 supplies a high-level transfer signal TGL0,the reset gate signal RSTg, and the selection signal SEL over a fixedpulse period. As a result, the floating diffusion layer in the L pixelcorresponding to the transfer signal TGL0 is initialized.

Then, at the timing T11 that is the end of the exposure period, the rowscanning circuit 210 supplies the high-level transfer signal TGL0 andthe reset gate signal RSTg over a fixed pulse period. Further, the rowscanning circuit 210 supplies a high-level selection signal SEL over theperiod from the timing T11 to the completion of the AD conversion. As aresult, a pixel signal corresponding to the exposure amount is outputfrom the L pixel corresponding to the transfer signal TGL0.

After the reading of the L pixel is completed, the R pixel is read by asimilar procedure. Reading of these L pixels and R pixels is executedrow by row. The focusing unit 250 detects a phase difference from eachpixel signal of the L pixel and the R pixel, and obtains the focusingposition of the focus lens from the phase difference.

In this focusing period, the row scanning circuit 210 supplies the resetdrain signal RSTd of the high level VH1.

FIG. 13 is a timing chart illustrating an example of the operation ofthe solid-state imaging element 200 during the imaging period in thefirst embodiment of the present technology. At the exposure start timingT20, the row scanning circuit 210 supplies the high level transfersignal TGL0, the reset gate signal RSTg, and the selection signal SELover a fixed pulse period. Due to this, the floating diffusion layer inthe L pixel corresponding to the transfer signal TGL0 is initialized.

Then, at the timing T22 of the end of the exposure period, the rowscanning circuit 210 supplies the high-level transfer signal TGL0 andthe reset gate signal RSTg over a fixed pulse period. Further, the rowscanning circuit 210 supplies the high-level selection signal SEL overthe period from the timing T11 to the completion of the AD conversion.As a result, a pixel signal corresponding to the exposure amount isoutput from the L pixel corresponding to the transfer signal TGL0.

Further, the row scanning circuit 210 takes control to change the resetdrain signal RSTd from the low level VL1 to the high level VH1 at thetiming T21 immediately before the end of the exposure.

As exemplified in FIGS. 12 and 13, the row scanning circuit 210supplies, during the focusing period, the reset drain signal RSTd of thehigh level VH1 higher than the low level VL1 in the imaging period. As aresult, control is taken so that the drain potential of the resettransistor 383 in the focusing period is set to a value higher than thatin the imaging period.

FIG. 14 is a graph illustrating an example of the relationship betweenthe reset drain potential and the transfer back gate potential in thefirst embodiment of the present technology. The horizontal axis in thefigure represents the reset drain potential, which is the drainpotential of the reset transistor 383. The vertical axis in the figurerepresents the transfer back gate potential, which is the back gatepotential of the transfer transistor 312. Further, in the figure, thedash dotted line indicates the potential of the potential barrierbetween the L pixel 310 and the R pixel 320.

As exemplified in the figure, as the reset drain potential is madehigher, the transfer back gate potential becomes higher. This is becausethe drain current of the reset transistor 383 in the on-state increasesas the reset drain potential increases, which increases the potential ofthe floating diffusion layer 384 at the time of initialization, and thepotential of the substrate 411 (back gate potential) provided with thefloating diffusion layer 384 also increases.

The row scanning circuit 210 takes control so that the transfer backgate potential has a value equal to or higher than the potential barrierby the reset drain signal RSTd of the high level VH1 during the focusingperiod. On the other hand, during the imaging period, the row scanningcircuit 210 takes control so that the transfer back gate potential has avalue lower than the potential barrier by the reset drain signal RSTd ofthe low level VL1. That is, the value of the transfer back gate voltage,which is the transfer back gate potential with respect to the potentialbarrier, is controlled in the focusing period to be set to a valuedifferent from that in the imaging period. Note that the row scanningcircuit 210 is an example of the control unit described in the claims.

FIG. 15 is an example of a potential diagram at the time of focusing inthe first embodiment of the present technology. The figure illustratesthe potential before charge transfer along the line C-D in the plan viewexemplified in FIG. 4 in the focusing period. In the figure, it isindicated that the potential becomes lower according to the downwardarrow direction. The dotted line represents the potential of thecomparative example in which the reset drain potential during thefocusing period is the same as that in the imaging period. Further, thesolid line indicates the potential in the solid-state imaging element200 that takes control so that the reset drain potential during thefocusing period has a value higher than that in the imaging period.

The potentials of the photoelectric conversion elements 311 and 321fluctuate in accordance with the amount of generated electric charges(electrons and the like). For example, in the R pixel 320, in the casewhere electrons more than in the R pixel 320 are generated by thephotoelectric conversion, the potential of the photoelectric conversionelement 321 in the R pixel 320 becomes lower than that in thephotoelectric conversion element 311 in the L pixel 310.

In the comparative example in which the reset drain potential is notcontrolled, the transfer back gate potentials of both the transfertransistors 312 and 322 are lower than the potential barrier between thephotoelectric conversion elements 311 and 321. In this configuration, inthe case where the amount of received light is large, for example, theelectrons overflowing from the R pixel 320 may flow over the potentialbarrier into the L pixel 310. In this case, the signals of the L pixel310 and the R pixel 320 are mixed to cause color mixing. When colormixing occurs, the detection accuracy of the phase difference maydecrease.

On the other hand, the row scanning circuit 210 takes control so thatthe reset drain potential during the focusing period has a value higherthan that in the imaging period. When the reset drain potential becomeshigh, the transfer back gate potential becomes high as described above,and has a value higher than the potential barrier. As a result, colormixing can be prevented, and the phase difference detection accuracy canbe improved.

Note that the solid-state imaging element 200 accumulates electrons aselectric charges and takes control so that the reset drain potential atthe time of focusing is higher than that at the time of imaging, but theconfiguration is not limited to this. Holes may be accumulated as theelectric charges. In this case, it is sufficient if the row scanningcircuit 210 makes the reset drain potential at the time of focusinglower than that at the time of imaging.

FIG. 16 is an example of a potential diagram at the time of imaging inthe first embodiment of the present technology. The figure illustratesthe potential before charge transfer along the line C-D in the plan viewexemplified in FIG. 4 during the imaging period. The dotted linerepresents the potential of the comparative example in which the resetdrain potential during the imaging period is the same as that in thefocusing period. Further, the solid line indicates the potential in thesolid-state imaging element 200 that takes control so that the resetdrain potential during the imaging period has a value lower than that ofthe focusing period.

In the comparative example in which the reset drain potential is notcontrolled, the potential barrier between the photoelectric conversionelements 311 and 321 has a value equal to or higher than the transferback gate potentials of both the transfer transistors 312 and 322. Inthis configuration, the saturation signal amount when the total signalamounts of the L pixel 310 and the R pixel 320 are saturated may not besufficiently increased. This is because the electrons generated by thephotoelectric conversion elements 311 and 321 cannot go over thepotential barrier and are discharged from the back gate of the transfertransistors 312 and 322. Further, the potential barrier varies frompixel to pixel. Therefore, the saturation signal amount may vary frompixel to pixel.

On the other hand, the row scanning circuit 210 takes control so thatthe reset drain potential during the imaging period has a value lowerthan that in the focusing period. When the reset drain potential becomeslower, the transfer back gate potential becomes lower as describedabove, and has a value lower than the potential barrier. As a result, itis possible to suppress the discharge of electrons from the back gatesof the transfer transistors 312 and 322, and to increase the saturationsignal amount as compared with the comparative example.

FIG. 17 is a graph illustrating an example of the total signal amountaccording to the exposure time in the first embodiment of the presenttechnology. The vertical axis in the figure represents the total signalamount which is the total of the pixel signals of each of the L pixel310 and the R pixel 320. The horizontal axis in the figure indicates theexposure time. Further, the solid line in the figure represents thefluctuation of the total signal amount in the solid-state imagingelement 200 that makes the reset drain potential at the time of imaginghigher than that at the time of focusing. Further, the dotted line inthe figure represents the fluctuation of the total signal amount of thecomparative example in which the reset drain potential is constant.

As the exposure time increases, the total signal amount increaseslinearly and saturates after a certain exposure time. The saturationsignal amount at this time is increased as compared with the comparativeexample by making the reset drain potential lower than that at the timeof focusing. This makes it possible to ensure the linearity of the totalsignal amount at the time of imaging and improve the image quality ofthe image data.

FIG. 18 is a flowchart illustrating an example of the operation of thesolid-state imaging element 200 according to the first embodiment of thepresent technology. This operation is started, for example, when apredetermined application for capturing image data is executed.

The row scanning circuit 210 sets the reset drain potential to the highlevel VH1 (step S901), and reads out the pixel signal of each of the Lpixel and the R pixel (step S902). Then, the focusing unit 250 detectsthe phase difference from the read pixel signal, and obtains thefocusing position from the phase difference, thereby starting driving tomove the focus lens to the focusing position (step S903). The focusingunit 250 determines whether or not the driving is completed (step S904).In the case where the driving is not completed (step S904: No), thefocusing unit 250 repeats step S904.

In the case where the driving is completed (step S904: Yes), the rowscanning circuit 210 sets the reset drain potential to the low level VL1(step S905) and reads out the pixel signals of each of the L pixel andthe R pixel (step S906). Then, the image processing unit 260 synthesizesthe respective pixel signals of the L pixel and the R pixel to generateimage data (step S907). After step S907, the solid-state imaging element200 ends the operation for capturing image data.

As described above, according to the first embodiment of the presenttechnology, the row scanning circuit 210 takes control so that thetransfer back gate voltage, which is the transfer back gate potentialwith respect to the potential barrier at the time of focusing, has avalue different from that at the time of imaging. Therefore, electronscan be prevented from moving between pixels beyond the potentialbarrier. This makes it possible to prevent color mixing and improve theaccuracy of detecting the phase difference.

2. Second Embodiment

In the first embodiment described above, the row scanning circuit 210controls the transfer back gate voltage by controlling the reset drainpotential, but in this configuration, it is necessary to arrange thereset drain drive wiring 215 for controlling the reset drain potentialfor each FD row. Therefore, the number of wirings increases because ofaddition of the reset drain drive wirings 215. The row scanning circuit210 of the second embodiment is different from that in the firstembodiment in that the gate potential of the transfer transistor iscontrolled instead of the reset drain potential.

FIG. 19 is a circuit diagram illustrating a configuration example of theFD sharing block 301 according to the second embodiment of the presenttechnology. The FD sharing block 301 of the second embodiment isdifferent from that of the first embodiment in that the reset draindrive wirings 215 are not arranged. The drain of the reset transistor383 is connected together with the amplification transistor 385 to thepower supply.

FIG. 20 is a timing chart illustrating an example of the operation ofthe solid-state imaging element 200 in the focusing period in the secondembodiment of the present technology. The control timing of the transfersignal TGL0, the reset gate signal RSTg, and the selection signal SEL inthe second embodiment is similar to that in the first embodiment.

However, the low level of the transfer signal TGL0 is set to a value VH2higher than the low level in the imaging period.

FIG. 21 is a timing chart illustrating an example of the operation ofthe solid-state imaging element 200 during the imaging period in thesecond embodiment of the present technology. The control timing of thetransfer signal TGL0, the reset gate signal RSTg, and the selectionsignal SEL in the second embodiment is similar to that in the firstembodiment.

However, the low level of the transfer signal TGL0 is set to a value VL2lower than the low level in the focusing period. Further, the resetdrain voltage is controlled so as to have the same value as the value inthe focusing period.

As exemplified in FIGS. 20 and 21, the row scanning circuit 210 takescontrol so that the low level of the transfer gate signal duringfocusing has a higher value than during imaging. As a result, thetransfer back gate voltage at the time of focusing can be set to a valuehigher than that at the time of imaging as in the first embodiment.

As described above, according to the second embodiment of the presenttechnology, since the row scanning circuit 210 makes the gate potentialof the transfer transistor at the time of focusing higher than that atthe time of imaging, the transfer back gate potential can be controlledwithout operating the reset drain potential. Due to this, it is notnecessary to install the reset drain drive wiring, and the number ofwirings can be reduced.

3. Application Example to Mobile Body

The technology related to the present disclosure (present technology)can be applied to various kinds of products. For example, the technologyaccording to the present disclosure may be achieved as a device mountedon a mobile body of any kind such as an automobile, an electric vehicle,a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility,an airplane, a drone, a ship, and a robot.

FIG. 22 is a block diagram depicting an example of schematicconfiguration of a vehicle control system as an example of a mobile bodycontrol system to which the technology according to an embodiment of thepresent disclosure can be applied.

The vehicle control system 12000 includes a plurality of electroniccontrol units connected to each other via a communication network 12001.In the example depicted in FIG. 22, the vehicle control system 12000includes a driving system control unit 12010, a body system control unit12020, an outside-vehicle information detecting unit 12030, anin-vehicle information detecting unit 12040, and an integrated controlunit 12050. In addition, a microcomputer 12051, a sound/image outputsection 12052, and a vehicle-mounted network interface (I/F) 12053 areillustrated as a functional configuration of the integrated control unit12050.

The driving system control unit 12010 controls the operation of devicesrelated to the driving system of the vehicle in accordance with variouskinds of programs. For example, the driving system control unit 12010functions as a control device for a driving force generating device forgenerating the driving force of the vehicle, such as an internalcombustion engine, a driving motor, or the like, a driving forcetransmitting mechanism for transmitting the driving force to wheels, asteering mechanism for adjusting the steering angle of the vehicle, abraking device for generating the braking force of the vehicle, and thelike.

The body system control unit 12020 controls the operation of variouskinds of devices provided to a vehicle body in accordance with variouskinds of programs. For example, the body system control unit 12020functions as a control device for a keyless entry system, a smart keysystem, a power window device, or various kinds of lamps such as aheadlamp, a backup lamp, a brake lamp, a turn signal, a fog lamp, or thelike. In this case, radio waves transmitted from a mobile device as analternative to a key or signals of various kinds of switches can beinput to the body system control unit 12020. The body system controlunit 12020 receives these input radio waves or signals, and controls adoor lock device, the power window device, the lamps, or the like of thevehicle.

The outside-vehicle information detecting unit 12030 detects informationabout the outside of the vehicle including the vehicle control system12000. For example, the outside-vehicle information detecting unit 12030is connected with an imaging section 12031. The outside-vehicleinformation detecting unit 12030 makes the imaging section 12031 imagean image of the outside of the vehicle, and receives the imaged image.On the basis of the received image, the outside-vehicle informationdetecting unit 12030 may perform processing of detecting an object suchas a human, a vehicle, an obstacle, a sign, a character on a roadsurface, or the like, or processing of detecting a distance thereto.

The imaging section 12031 is an optical sensor that receives light, andwhich outputs an electric signal corresponding to a received lightamount of the light. The imaging section 12031 can output the electricsignal as an image, or can output the electric signal as informationabout a measured distance. In addition, the light received by theimaging section 12031 may be visible light, or may be invisible lightsuch as infrared rays or the like.

The in-vehicle information detecting unit 12040 detects informationabout the inside of the vehicle. The in-vehicle information detectingunit 12040 is, for example, connected with a driver state detectingsection 12041 that detects the state of a driver. The driver statedetecting section 12041, for example, includes a camera that images thedriver. On the basis of detection information input from the driverstate detecting section 12041, the in-vehicle information detecting unit12040 may calculate a degree of fatigue of the driver or a degree ofconcentration of the driver, or may determine whether the driver isdozing.

The microcomputer 12051 can calculate a control target value for thedriving force generating device, the steering mechanism, or the brakingdevice on the basis of the information about the inside or outside ofthe vehicle which information is obtained by the outside-vehicleinformation detecting unit 12030 or the in-vehicle information detectingunit 12040, and output a control command to the driving system controlunit 12010. For example, the microcomputer 12051 can perform cooperativecontrol intended to implement functions of an advanced driver assistancesystem (ADAS) which functions include collision avoidance or shockmitigation for the vehicle, following driving based on a followingdistance, vehicle speed maintaining driving, a warning of collision ofthe vehicle, a warning of deviation of the vehicle from a lane, or thelike.

In addition, the microcomputer 12051 can perform cooperative controlintended for automatic driving, which makes the vehicle to travelautonomously without depending on the operation of the driver, or thelike, by controlling the driving force generating device, the steeringmechanism, the braking device, or the like on the basis of theinformation about the outside or inside of the vehicle which informationis obtained by the outside-vehicle information detecting unit 12030 orthe in-vehicle information detecting unit 12040.

In addition, the microcomputer 12051 can output a control command to thebody system control unit 12020 on the basis of the information about theoutside of the vehicle which information is obtained by theoutside-vehicle information detecting unit 12030. For example, themicrocomputer 12051 can perform cooperative control intended to preventa glare by controlling the headlamp so as to change from a high beam toa low beam, for example, in accordance with the position of a precedingvehicle or an oncoming vehicle detected by the outside-vehicleinformation detecting unit 12030.

The sound/image output section 12052 transmits an output signal of atleast one of a sound and an image to an output device capable ofvisually or auditorily notifying information to an occupant of thevehicle or the outside of the vehicle. In the example of FIG. 22, anaudio speaker 12061, a display section 12062, and an instrument panel12063 are illustrated as the output device. The display section 12062may, for example, include at least one of an on-board display and ahead-up display.

FIG. 23 is a diagram depicting an example of the installation positionof the imaging section 12031.

In FIG. 23, the imaging section 12031 includes imaging sections 12101,12102, 12103, 12104, and 12105.

The imaging sections 12101, 12102, 12103, 12104, and 12105 are, forexample, disposed at positions on a front nose, sideview mirrors, a rearbumper, and a back door of the vehicle 12100 as well as a position on anupper portion of a windshield within the interior of the vehicle. Theimaging section 12101 provided to the front nose and the imaging section12105 provided to the upper portion of the windshield within theinterior of the vehicle obtain mainly an image of the front of thevehicle 12100. The imaging sections 12102 and 12103 provided to thesideview mirrors obtain mainly an image of the sides of the vehicle12100. The imaging section 12104 provided to the rear bumper or the backdoor obtains mainly an image of the rear of the vehicle 12100. Theimaging section 12105 provided to the upper portion of the windshieldwithin the interior of the vehicle is used mainly to detect a precedingvehicle, a pedestrian, an obstacle, a signal, a traffic sign, a lane, orthe like.

Incidentally, FIG. 23 depicts an example of photographing ranges of theimaging sections 12101 to 12104. An imaging range 12111 represents theimaging range of the imaging section 12101 provided to the front nose.Imaging ranges 12112 and 12113 respectively represent the imaging rangesof the imaging sections 12102 and 12103 provided to the sideviewmirrors. An imaging range 12114 represents the imaging range of theimaging section 12104 provided to the rear bumper or the back door. Abird's-eye image of the vehicle 12100 as viewed from above is obtainedby superimposing image data imaged by the imaging sections 12101 to12104, for example.

At least one of the imaging sections 12101 to 12104 may have a functionof obtaining distance information. For example, at least one of theimaging sections 12101 to 12104 may be a stereo camera constituted of aplurality of imaging elements, or may be an imaging element havingpixels for phase difference detection.

For example, the microcomputer 12051 can determine a distance to eachthree-dimensional object within the imaging ranges 12111 to 12114 and atemporal change in the distance (relative speed with respect to thevehicle 12100) on the basis of the distance information obtained fromthe imaging sections 12101 to 12104, and thereby extract, as a precedingvehicle, a nearest three-dimensional object in particular that ispresent on a traveling path of the vehicle 12100 and which travels insubstantially the same direction as the vehicle 12100 at a predeterminedspeed (for example, equal to or more than 0 km/hour). Further, themicrocomputer 12051 can set a following distance to be maintained infront of a preceding vehicle in advance, and perform automatic brakecontrol (including following stop control), automatic accelerationcontrol (including following start control), or the like. It is thuspossible to perform cooperative control intended for automatic drivingthat makes the vehicle travel autonomously without depending on theoperation of the driver or the like.

For example, the microcomputer 12051 can classify three-dimensionalobject data on three-dimensional objects into three-dimensional objectdata of a two-wheeled vehicle, a standard-sized vehicle, a large-sizedvehicle, a pedestrian, a utility pole, and other three-dimensionalobjects on the basis of the distance information obtained from theimaging sections 12101 to 12104, extract the classifiedthree-dimensional object data, and use the extracted three-dimensionalobject data for automatic avoidance of an obstacle. For example, themicrocomputer 12051 identifies obstacles around the vehicle 12100 asobstacles that the driver of the vehicle 12100 can recognize visuallyand obstacles that are difficult for the driver of the vehicle 12100 torecognize visually. Then, the microcomputer 12051 determines a collisionrisk indicating a risk of collision with each obstacle. In a situationin which the collision risk is equal to or higher than a set value andthere is thus a possibility of collision, the microcomputer 12051outputs a warning to the driver via the audio speaker 12061 or thedisplay section 12062, and performs forced deceleration or avoidancesteering via the driving system control unit 12010. The microcomputer12051 can thereby assist in driving to avoid collision.

At least one of the imaging sections 12101 to 12104 may be an infraredcamera that detects infrared rays. The microcomputer 12051 can, forexample, recognize a pedestrian by determining whether or not there is apedestrian in imaged images of the imaging sections 12101 to 12104. Suchrecognition of a pedestrian is, for example, performed by a procedure ofextracting characteristic points in the imaged images of the imagingsections 12101 to 12104 as infrared cameras and a procedure ofdetermining whether or not it is the pedestrian by performing patternmatching processing on a series of characteristic points representingthe contour of the object. When the microcomputer 12051 determines thatthere is a pedestrian in the imaged images of the imaging sections 12101to 12104, and thus recognizes the pedestrian, the sound/image outputsection 12052 controls the display section 12062 so that a squarecontour line for emphasis is displayed so as to be superimposed on therecognized pedestrian. The sound/image output section 12052 may alsocontrol the display section 12062 so that an icon or the likerepresenting the pedestrian is displayed at a desired position.

The example of the vehicle control system to which the techniqueaccording to the present disclosure can be applied has been describedabove. The technique according to the present disclosure can be appliedto the imaging section 12031 among the configurations described above.To be specific, the imaging device 100 in FIG. 1 can be applied to theimaging section 12031. By applying the technique according to thepresent disclosure to the imaging section 12031, it is possible toimprove the detection accuracy of the phase difference and obtaincaptured images that are easier to see, so that the driver's fatigue canbe reduced.

It should be noted that the above-described embodiments demonstrateexamples for embodying the present technology, and the matters in theembodiments and the matters specifying the invention in the claims havea correspondence relationship with each other. Similarly, the mattersspecifying the invention within the scope of claims and the matters inthe embodiments of the present technology having the same names have acorrespondence relationship with each other. However, the presenttechnology is not limited to the embodiments, and can be embodied byapplying various kinds of modifications to the embodiments withoutdeparting from the gist thereof.

It should be noted that the effects described in the presentspecification are merely examples and the technology is not limitedthereto so that other effects may be obtained.

Note that the present technology can also have the followingconfigurations.

(1) A solid-state imaging element including:

a pair of photoelectric conversion elements that receive a pair of lightrays made by pupil-splitting;

a floating diffusion layer that generates a pair of pixel signals fromelectric charge transferred from each of the pair of photoelectricconversion elements;

a pair of transfer transistors that transfer the electric charge fromthe pair of photoelectric conversion elements to the floating diffusionlayer; and

a control unit that takes control such that back gate voltages thatinclude back gate potentials of both of the pair of transfer transistorswith respect to a potential barrier between the pair of photoelectricconversion elements have values different from values in a case ofsynthesizing the pair of pixel signals, in a case of detecting a phasedifference of the pair of light rays from the pair of pixel signals.

(2) The solid-state imaging element described in (1), further including:

a reset transistor that initializes an amount of the electric charge inthe floating diffusion layer, in which

the control unit controls the back gate voltages by controlling a drainpotential of the reset transistor.

(3) The solid-state imaging element described in (2), in which

a reset drain drive wiring is provided to connect a drain of the resettransistor and the control unit, and

the control unit controls the drain potential via the reset drain drivewiring.

(4) The solid-state imaging element described in (1), in which

the control unit controls the back gate voltages by controlling gatepotentials of both of the pair of transfer transistors.

(5) The solid-state imaging element described in any one of (1) to (4),in which

the electric charge includes an electron, and

in the case of detecting the phase difference, the control unit takescontrol such that the back gate voltages are higher than those in thecase of synthesizing the pair of pixel signals.

(6) The solid-state imaging element described in any one of (1) to (5),in which

in the case of synthesizing the pair of pixel signals, the control unitcontrols the back gate voltages after a start of exposure of the pair ofphotoelectric conversion elements.

(7) The solid-state imaging element described in any one of (1) to (6),further including:

an on-chip lens that collects a light ray; and

a color filter that allows a light ray having a wavelength within apredetermined wavelength range and coming from the on-chip lens to passthrough the color filter, in which

the pair of photoelectric conversion elements receive the light ray thathas passed through the color filter.

(8) An imaging device including:

a pair of photoelectric conversion elements that receive a pair of lightrays made by pupil-splitting;

a floating diffusion layer that generates a pair of pixel signals fromelectric charge transferred from each of the pair of photoelectricconversion elements;

a pair of transfer transistors that transfer the electric charge fromthe pair of photoelectric conversion elements to the floating diffusionlayer;

a control unit that takes control such that back gate voltages thatinclude back gate potentials of both of the pair of transfer transistorswith respect to a potential barrier between the pair of photoelectricconversion elements have values different from values in a case ofsynthesizing the pair of pixel signals, in a case of detecting a phasedifference of the pair of light rays from the pair of pixel signals; and

a processing unit that performs a process of synthesizing the pair ofpixel signals.

(9) A method for controlling a solid-state imaging element including thesteps of:

transferring, by a pair of transfer transistors, electric charge from apair of photoelectric conversion elements that receive a pair of lightrays made by pupil-splitting to a floating diffusion layer thatgenerates a pair of pixel signals from the electric charge transferredfrom each of the pair of photoelectric conversion elements; and

taking control such that back gate voltages that include back gatepotentials of both of the pair of transfer transistors with respect to apotential barrier between the pair of photoelectric conversion elementshave values different from values in a case of synthesizing the pair ofpixel signals, in a case of detecting a phase difference of the pair oflight rays from the pair of pixel signals.

REFERENCE SIGNS LIST

100 Imaging device

110 Optical unit

120 DSP circuit

130 Display unit

140 Operation unit

150 Bus

160 Frame memory

170 Storage unit

180 Power supply unit

200 Solid-state imaging element

210 Row scanning circuit

211 to 214 Transfer gate drive wiring

215 Reset drain drive wiring

216 Reset gate drive wiring

217 Selection gate drive wiring

220 Timing control unit

230, 240 Column signal processing unit

250 Focusing unit

260 Image processing unit

300 Pixel array unit

301 FD sharing block

302 Ground line

303 Power supply line

304, 305 Vertical signal line

310, 330, 350, 370 L pixel

311, 321, 331, 341, 351, 361, 371, 381 Photoelectric conversion element

312, 322, 332, 342, 352, 362, 372, 382 Transfer transistor

320, 340, 360, 380 R pixel

383 Reset transistor

384 Floating diffusion layer

385 Amplification transistor

386 Selection transistor

401 On-chip lens

402 Color filter

411 Substrate

412 P layer

413 Transfer gate

421 Reset source

422 Reset gate

423 Reset drain

424 Amplifier drain

425 Amplifier gate

426 Source/drain

427 Selection gate

428 Selection source

430 Wiring layer

12031 Imaging section

1. A solid-state imaging element comprising: a pair of photoelectricconversion elements that receive a pair of light rays made bypupil-splitting; a floating diffusion layer that generates a pair ofpixel signals from electric charge transferred from each of the pair ofphotoelectric conversion elements; a pair of transfer transistors thattransfer the electric charge from the pair of photoelectric conversionelements to the floating diffusion layer; and a control unit that takescontrol such that back gate voltages that include back gate potentialsof both of the pair of transfer transistors with respect to a potentialbarrier between the pair of photoelectric conversion elements havevalues different from values in a case of synthesizing the pair of pixelsignals, in a case of detecting a phase difference of the pair of lightrays from the pair of pixel signals.
 2. The solid-state imaging elementaccording to claim 1, further comprising: a reset transistor thatinitializes an amount of the electric charge in the floating diffusionlayer, wherein the control unit controls the back gate voltages bycontrolling a drain potential of the reset transistor.
 3. Thesolid-state imaging element according to claim 2, wherein a reset draindrive wiring is provided to connect a drain of the reset transistor andthe control unit, and the control unit controls the drain potential viathe reset drain drive wiring.
 4. The solid-state imaging elementaccording to claim 1, wherein the control unit controls the back gatevoltages by controlling gate potentials of both of the pair of transfertransistors.
 5. The solid-state imaging element according to claim 1wherein the electric charge includes an electron, and in the case ofdetecting the phase difference, the control unit takes control such thatthe back gate voltages are higher than those in the case of synthesizingthe pair of pixel signals.
 6. The solid-state imaging element accordingto claim 1, wherein in the case of synthesizing the pair of pixelsignals, the control unit controls the back gate voltages after a startof exposure of the pair of photoelectric conversion elements.
 7. Thesolid-state imaging element according to claim 1, further comprising: anon-chip lens that collects a light ray; and a color filter that allows alight ray having a wavelength within a predetermined wavelength rangeand coming from the on-chip lens to pass through the color filter,wherein the pair of photoelectric conversion elements receive the lightray that has passed through the color filter.
 8. An imaging devicecomprising: a pair of photoelectric conversion elements that receive apair of light rays made by pupil-splitting; a floating diffusion layerthat generates a pair of pixel signals from electric charge transferredfrom each of the pair of photoelectric conversion elements; a pair oftransfer transistors that transfer the electric charge from the pair ofphotoelectric conversion elements to the floating diffusion layer; acontrol unit that takes control such that back gate voltages thatinclude back gate potentials of both of the pair of transfer transistorswith respect to a potential barrier between the pair of photoelectricconversion elements have values different from values in a case ofsynthesizing the pair of pixel signals, in a case of detecting a phasedifference of the pair of light rays from the pair of pixel signals; anda processing unit that performs a process of synthesizing the pair ofpixel signals.
 9. A method for controlling a solid-state imaging elementcomprising the steps of: transferring, by a pair of transfertransistors, electric charge from a pair of photoelectric conversionelements that receive a pair of light rays made by pupil-splitting to afloating diffusion layer that generates a pair of pixel signals from theelectric charge transferred from each of the pair of photoelectricconversion elements; and taking control such that back gate voltagesthat include back gate potentials of both of the pair of transfertransistors with respect to a potential barrier between the pair ofphotoelectric conversion elements have values different from values in acase of synthesizing the pair of pixel signals, in a case of detecting aphase difference of the pair of light rays from the pair of pixelsignals.